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Most semiconductor manufactures has their own succestions to designing rules for BGA components. There is no general rules for BGA's. Take a look to Xilinx and Altera web sites. Both has very good application notes for PCB layout.
The BGA packages are (generally speaking) quite standardized, and the industry has already a lot of experience of different issues. Therefore one can often adapt from one producer's recommendations to some other producer's devices. Differences in recommendations are usualy very small, if the packages are with identical parameters. Just check carefully that your package has same solder ball dimensions, pitch etc. than the one described in the document.
Also, it is generally good to talk with the PCB assembly people. Note also that such things as optical positioning markers, which are not directly related to the package but more to equipment used for mounting, are also important.