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Any suggestion of packaging for high frequency application

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kokmin

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Hi, I am designing 802.11a receiver module. The problem is a high bonding wire kills the performance over 3GHz. Any idea regarding package type for such high frequency application?

THX.
 

falling_stone

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Re: Any suggestion of packaging for high frequency applicati

Hi, Kokmin.
I beleive that FC (flip chip) BGA or some CSP (chip scale package) may be usefull in Your case. You may go, for example, to www.asegroup.com.tw to find more information about packaging solutions.
Best Wishes,
F.S.
 

jerk kwork

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Re: Any suggestion of packaging for high frequency applicati

FC BGA may be too expensive . You can try BGA with impedance control. :?
 

falling_stone

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Re: Any suggestion of packaging for high frequency applicati

I agree, FC BGA is expensive, and it is possible to control substrate impedance in BGA, but is it possible to avoid bonding wire inductance impact for signal traces (for power/ground just multipy their quantity) ? Also by multiple bonding ?
 

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