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3D Packaging Technology
3D Pakaging Technology is the latest Electronic Packaging Technique where bare ICs/SMDs are stacked along Z-axis resulting in considerable size reduction. I have projected and designed one circuit in 1" cube resulting a volume reduction of approximately 1/10th. This particular Package comes in 8 layers of flexible PCBs with interconnection on the 4 vertical sides.
3D Pakaging Technology is the latest Electronic Packaging Technique where bare ICs/SMDs are stacked along Z-axis resulting in considerable size reduction. I have projected and designed one circuit in 1" cube resulting a volume reduction of approximately 1/10th. This particular Package comes in 8 layers of flexible PCBs with interconnection on the 4 vertical sides.