Continue to Site

Welcome to EDAboard.com

Welcome to our site! EDAboard.com is an international Electronics Discussion Forum focused on EDA software, circuits, schematics, books, theory, papers, asic, pld, 8051, DSP, Network, RF, Analog Design, PCB, Service Manuals... and a whole lot more! To participate you need to register. Registration is free. Click here to register now.

Register Log in

3D Packaging Technology: the latest Packaging Technique

Status
Not open for further replies.
M

MA.SHERIFF

Newbie level 3
Joined
Aug 13, 2005
Messages
3
Helped
0
Reputation
0
Reaction score
0
Trophy points
1,281
Location
Trivandrum, India
Activity points
1,314
3D Packaging Technology

3D Pakaging Technology is the latest Electronic Packaging Technique where bare ICs/SMDs are stacked along Z-axis resulting in considerable size reduction. I have projected and designed one circuit in 1" cube resulting a volume reduction of approximately 1/10th. This particular Package comes in 8 layers of flexible PCBs with interconnection on the 4 vertical sides.
 

Re: 3D Packaging Technology

It seems that's the trend of future IC package development.

best regards




MA.SHERIFF said:
3D Pakaging Technology is the latest Electronic Packaging Technique where bare ICs/SMDs are stacked along Z-axis resulting in considerable size reduction. I have projected and designed one circuit in 1" cube resulting a volume reduction of approximately 1/10th. This particular Package comes in 8 layers of flexible PCBs with interconnection on the 4 vertical sides.
Click to expand...
 

Status
Not open for further replies.

Similar threads

Part and Inventory Search

Welcome to EDABoard.com

Sponsor

Back
Top