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based on what criteria? temperature rise for outside track inside thermally insulated to FR4?
Lots out there. But for big jobs like Stovetop heater Relays, OEM thruhole busbars and crosshashed solderblobs are often done.
Then designers forget to reinforce large parts with polyurethane to prevent solder annular ring break in solder joints and boards fail within years even in benign home and office environments. This can also happen when holes are too large and looks under a microscope like a crystalline annular ring between pin and hole connected to a large trace carrying large currents. ( i.e. intermettent open connection) Oxidation ends up opening the solder joint with an insulation oxide in a solder joint that otherwise looked flawless when new. Just a heads up... from a stove top board and MAC CRT monitored , I once repaired with large traces and big parts.
MOST PSU's you will find use this on big parts to hold them from vibrations.
Use the latest Saturn PCB tool, it uses current standards - many other calculators give different results because they use outdated information.
Or use a calculator and do it manually.
The first one is out of date as it is not based on IPC-2152, the rest are not current calculators!!!
Use Saturn as stated by the HDMI Kid (Mattylad, where is my cable?)
Er care to explain how you can have an outside track inside thermally insulated FR4, I would suspect that some laws of physics here may have to be re-written!:smile:
I do loads of boards with high current, if I have the layers I run them all as planar bus bars on multiple layers, I choose a temp rise of 10 deg above ambient so I have more safety margin and where possible use a trace width 25-50% larger than specified, larger if possible or use multiple layers. I also like to use inner layers for high voltages as it helps reduce clearance distances....
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