the above is a typical method. Anyway, your design idea is very import. Please keep the stackup as a symmetrical structure.
If you can tell us some parameters, such as total thickness, signal/GND distribution, whcih material you are preferred. Our engineer could get it out very easily.
the above is a typical method. Anyway, your design idea is very import. Please keep the stackup as a symmetrical structure.
If you can tell us some parameters, such as total thickness, signal/GND distribution, whcih material you are preferred. Our engineer could get it out very easily.
sorry, but from our manufacturing side, Pwr and GND are basically the same thing. Since both of them are inclined to increase copper area up to 80% or so. We care this point very much due to warp&twist issue and laminate as well.
In general, we use "PWR/GND" instead of a simple word "PWR" or "GND" in stackup.
normally what i follow is that i keep clks and high speed signals in between ground layers...
we route non critical signal on the top and bottom layer
we provide immidiate ground layer from component side so that the switcing noise from the components does not effect the high speed signals which are routed in the inner layers...
Check this link below,it will be very useful for your refernces...
This will be your ideal layer stackup,and it gives up the closely spaced power/ground plane pair,if you observe you will see all high speed signal are between the ground and power and acts like shielding for the critical signals.