john8791
Newbie level 3
I am in the process of re-laying out an existing 2 layer board into a 4 layer board. One half of the board is I/O, micro-controller, and supporting components. The other half are high side intelligent power MOSFET's. The 2 layer board is having EMI issues with a large DC pump motor. The MOSFET's are in place to drive 12VDC solenoid valves. My plan is having the layers stacked signal/gnd/power/signal. The caveat is that I want to split the power plane into 2 halves; one being 5V under the micro-controller circuitry and 12V under the MOSFET's. I have found a lot of discussion on split gnd planes but not too much on split power planes.
Can anyone give me some direction on the ramifications of this? Also, how much separation should I have between the split?
Thanks!
Can anyone give me some direction on the ramifications of this? Also, how much separation should I have between the split?
Thanks!