AllenD
Member level 5
Hi Guys
I am designing a filler cell for my mixed signal circuit. I design is with 2 principles:
1. There is no such thing as too many substrate contact
2. I want to add sufficient bypass caps
So, this is my single filler cell
In the center is a dc bypass cap and surrounded by a guard ring from substrate contact to high metal layers. As we can see, the substrate contact is enclosed by a PP layer (p+ ion implantation)
Then this is a cluster of filler cells
I realized my design of filler cell caused these pp layers connected all together. DRC and ERC did not report and problem
I am not clear on the purpose of the pp layer and I just know that pp drawings should surround the substrate contact. But for best design, do you think this amalgamated pp layers will be problematic?
Thanks
Allen
I am designing a filler cell for my mixed signal circuit. I design is with 2 principles:
1. There is no such thing as too many substrate contact
2. I want to add sufficient bypass caps
So, this is my single filler cell
In the center is a dc bypass cap and surrounded by a guard ring from substrate contact to high metal layers. As we can see, the substrate contact is enclosed by a PP layer (p+ ion implantation)
Then this is a cluster of filler cells
I realized my design of filler cell caused these pp layers connected all together. DRC and ERC did not report and problem
I am not clear on the purpose of the pp layer and I just know that pp drawings should surround the substrate contact. But for best design, do you think this amalgamated pp layers will be problematic?
Thanks
Allen