Puppet123
Full Member level 6
Hello,
I am doing dummy metal fill for a layout.
I have to add exclusion layers for metal fill not to be put in my circuit path - I need BOTH drawing exclusion layers AND via exclusion layers - they are both in the process I am using - TSMC. So do I need MEXCL(d1 to d8,for all metal 8 layers) AND the via layers to do exclusion ?
Is this correct ?
Thank you.
I am doing dummy metal fill for a layout.
I have to add exclusion layers for metal fill not to be put in my circuit path - I need BOTH drawing exclusion layers AND via exclusion layers - they are both in the process I am using - TSMC. So do I need MEXCL(d1 to d8,for all metal 8 layers) AND the via layers to do exclusion ?
Is this correct ?
Thank you.