Puppet123
Full Member level 6
Hello,
I am doing and RF IC layout and need to make my own pads as the PDK does not include them.
For the RF I/O pads I just but a top metal pad and nothing else while for the RF Gnd pads I stacked all the metal layers to my chosen ground plane.
Now for the Biasing pads ie. VDD and VDD Gnd, can I just use a stack of a metal layers again for these DC pads ?
Are there any resources, ie papers, etc that describe these considerations.
Thank you.
I am doing and RF IC layout and need to make my own pads as the PDK does not include them.
For the RF I/O pads I just but a top metal pad and nothing else while for the RF Gnd pads I stacked all the metal layers to my chosen ground plane.
Now for the Biasing pads ie. VDD and VDD Gnd, can I just use a stack of a metal layers again for these DC pads ?
Are there any resources, ie papers, etc that describe these considerations.
Thank you.