bondpads and normal pads

What are bond pads ?? Where it is used in chip packaging ?how they are differ from normal pads.
can anyone explain.Thanks in advance

Bond pads are large flat metal pads at the top surface of the IC (typically 50x50um or larger). These are used to attach bond wires from the package frame to the IC. The bond wire is typically gold or copper and is ultrasonically welded to the pad at final assembly.
Where the bond pad is used for solder bumps (flip chip that does not use bond wires) this is often called the Pad but really there is no huge difference. For flip chip, often the bond pad is connected to even more metal layers depositid and patterned on top of the final chip, to allow much larger pads to accept the solder bump.
Another pad is the micro-probe pad which could be much smaller than a bond pad. This is used to probe the inside of the device at critical points for debugging. These pads are covered up and cannot be used one the device is packaged. These would only really be used for very new designs where the circuit behaviour is not fully matured.