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• Providing enough signal layers to allow successful routing of all signals to signal
integrity rules.
• Creating copper thickness in planes and signal layers that meets the conductivity
demands of signals and power and, at the same time, be reasonable to
manufacture.
• Providing enough power and ground layers to meet the needs of the power
delivery system.
• Specifying trace widths and dielectric thicknesses that allow impedance targets to
be met.
• Insuring that the spacing between signal layers and their adjacent planes is thin
enough to satisfy crosstalk needs.
• Specifying dielectric materials that are economical to manufacture and readily
available.
• Avoiding the use of expensive techniques such as blind and buried vias and build
up processing if possible.
Stack-up is dependent on the following aspect -
1) no of singals / nets
2) area avaliability for routing the signals/nets
3) speed/freequecy of of the signals
4) no of power feed layers required
5) Kind of singals - Analog / Digital
6) Special singal consideration like lenght maching , single ended or differential etc.
7) Imdediance balance conditions like 50 ohm or 75 ohm
8) most important factor is cost
As per I know .....there is no general rule as such but one makes a call based on above factors....
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