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In Clock buffers rise & fall time are balanced. So while designing clock buffer Beta ratio should be chosen such that clock buffer/inverter rise & fall time should be same.
There are two reasons for delay improvement using inverter;
1. Compared to Buffer, Inverter cell delay is less [Buffer is noting but back 2 back connected inverter]
2. And using two inverter, RC delay delay is further divided & improving transition & delay...
Its better to get confirmation from TSMC, if you guys have a account. (DRC/LVS/Rule Deck)
Its better to use latest stable calibre version. Again confirm with Mentor.
These are very crucial decisions & need to review from all sides. There are cases of re-spin just for tool/deck version issues.
"hyun" is right.
Its always better to keep track & clean ICC DRC & LVS.
In latest technologies there are many complex Metal & Base DRC (During standard cell fillers) which ICC needs to handle.
Negligible run-time is one best advantage with ICC DRC & LVS. So its always good practice to clean...
Stacking of VIAs has lot of disadvantages from Process point of view. Generally its done in power mesh. Top power straps will be in higher metal level and hence to supply power to standard cell pre-routes (mostly it will be in M1 or M2) a intermediate metal (M6 - M3) will be partially used for...
I think the buffer replaced with 2 inverters is like this,
>-----------LONG NET------------------> BUFF ---------------LONG NET ----------->
If U divide the wire load and place two inverters, Input transition on 1st inverter and also load on first inverter will reduce...
Leakage power and Internal power are present on liberty file depending on the inputs.
U can use internal power number depending on the activity of the standard cell.
Metal2 usage does not depend on the drive strength of the cell. Complex cells like flop, scan flops and mux require metal2 (7 or 9 track require).
Metal2 usage blocks lot of routing resource when the particular cell is used in the design.
For example : U have used metal2 horizontally to...
W_Heisenberg ,
Whenever two nets are connected using MOAT or POLY it is called as SOFT Connection.
In ur case connect the well with the metal, that warning ll be cleared.
Funda behind doing matching is to compensate the effects due to process variations..
If number of fingers are less then we can say almost all devices sit in same place on the wafer..
If the devices are large then best thing is to increase the number of fingers and do common centroid matching..
owen_li
Fillers are added in the design to keep power rail and NWELL continuity. Also if design changes after BASE PG, then these FILLER can be replaced with ECO cells.
As oratie said, there is nothing to compare in FILLER. So NETLIST does not contain FILLER, but GDSII is the final...
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