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NMOS will be formed in the p-substrate and PMOS will be formed inside the N-well (in a normal N-well process). Bulk which is the fourth terminal of the transistor should be connected in such a way that the S/D terminal and Bulk terminal must be reverse biased , hence they are connected in...
For each technology there is a minimum grid specified in the PDK, I think you might have set the grid to that minimum value(you can change this by changing the display settings by pressing key 'e') and you are placing the path not in the grid.Place the path exactly on the grid dots your DRC will...
A P+ ring in psub is simply a superior ohmic connection,
ties the region together and to some current-return
point. It also creates a highly doped region which will
not invert even if the substrate does, eliminating
surface conduction (field NMOS being susceptible to
mobile ion and radiation...
hi all
I am having a gdsII file from a virtuoso LE i want to open and do the drc and lvs of it from another PC what are the required files and please tel the procedure....
regards
arun
Hi Joannes
Yes, 20 to 1 ratio is a problem...but in your pattern a lot of area will be wasted and also where is the centroid and symmetry in this pattern...please explain
..
If M1=15, M2=300 & D is dummy interdigitation can be done as
D(20*M2)M1(20*M2)M1(20*M2)M1(20*M2)M1(20*M2)M1(20*M2)M1(20*M2)M1(20*M2)M1M1(M2*20)M1(M2*20)M1(M2*20)M1(M2*20)M1(M2*20)M1(M2*20)M1(M2*20)M1
But this will increase horz area...try using commn centroid, so that it will be a compact one..
if u want to share u can use this
DABBABABBAD
DBAABABAABD
Regards
arun
---------- Post added at 18:40 ---------- Previous post was at 18:37 ----------
i think its better don't go for sharing, it will increase stress due to STI
D B A B A B A B A B D
D A B A B A B A B A D
I think this will provide better matching, here D is the dummy transistors and A & B are the transistors 2 be matched
Hi
Thanks for your reply, its very helpful.
So from what you said and what i studied i am just concluding how our gds2 will be used for fabrication, if i am wrong please correct it.
Our layout in gds2 format will be first printed into the mask(photo mask in case of photolithography),(how it is...
Hi all
can anyone explain how our layout output(gds2) is used in chip fabrication process, wat i understood is our gds2 file is used to make layout on photomask, and it will b used to project into wafer coated with photoresist..is it correct..plz explain the detailed process.
Regards
Arun
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