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I am curious: is GDS sent to the fab and the fab does further processing like OPC, or further steps are also a responsibility of the fabless semiconductor company?
This depends a lot on the product type and design flow, and
technology generations.
I'll hand over a chip-in-scribe GDS file and the foundry will throw
away my scribe ads substitute theirs with all the manstructs and
so on.
Depending on whether the foundry is "pure play" or "full service"
might bear on how much of the physical design, you or they
perform. I've been attached to both "send us the netlist" and
"send us the layout" design flows.
For a given tech the foundry will tell you what's the drill.
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