arunmaran10
Junior Member level 2
Hi All,
I am using 81 pin WLCSP package IC. In socket recommended pad dia is 0.3mm. But for 0.4mm pitch suggested pads is 0.265mm pad.
This is not matter for socket still i have to connect 2,3 pads diagonally in top layer. To do this i have to reduce some pad size. I need to know whether different pad size will affect assembly. Because i have doubt that there may be chance of short with adjacent pads during wave or re flow soldering if we have different pad size.
This is the case if i want to solder device in socket board.
Regards,
Arunmaran
I am using 81 pin WLCSP package IC. In socket recommended pad dia is 0.3mm. But for 0.4mm pitch suggested pads is 0.265mm pad.
This is not matter for socket still i have to connect 2,3 pads diagonally in top layer. To do this i have to reduce some pad size. I need to know whether different pad size will affect assembly. Because i have doubt that there may be chance of short with adjacent pads during wave or re flow soldering if we have different pad size.
This is the case if i want to solder device in socket board.
Regards,
Arunmaran