letrongdtk4
Newbie level 5
Hi all,
I have a PCB design for the Spartan-3E FG320 BGA in attach file.
1, Can you see schematic and send to me your remark ?
2, I will design PCB 4 layer.
- Stackup :
+ TOP (Signal1)
---------------------- 9 mil ------------------------------------------------------
+ GND Plane
----------------------- 50 mil -----------------------------------------------------
+ Power + Signal1
------------------------ 9mil ------------------------------------------------------
+ BOTTOM(Signal 2)
- Via Pad Diameter : 0.6mm
- Via Pad Hole : 0.3 mm
- Wide traces and space( inter-ball Area ) : 5 mil
- Wide trace and space (package outer) : 6 mil
- Power supply trace : 50 mil
- Based copper thickness : 1 oz (~ 34.3 um)
Then, i caculator the parameter from link : https://www.skottanselektronik.com/
My PCB manufacture is FAB-9 : https://fab-9.com/web/content/view/14/28/
All rule is true.
But, time the firt i design PCB multi layer.
I want to hear your advice
Thanks,
I have a PCB design for the Spartan-3E FG320 BGA in attach file.
1, Can you see schematic and send to me your remark ?
2, I will design PCB 4 layer.
- Stackup :
+ TOP (Signal1)
---------------------- 9 mil ------------------------------------------------------
+ GND Plane
----------------------- 50 mil -----------------------------------------------------
+ Power + Signal1
------------------------ 9mil ------------------------------------------------------
+ BOTTOM(Signal 2)
- Via Pad Diameter : 0.6mm
- Via Pad Hole : 0.3 mm
- Wide traces and space( inter-ball Area ) : 5 mil
- Wide trace and space (package outer) : 6 mil
- Power supply trace : 50 mil
- Based copper thickness : 1 oz (~ 34.3 um)
Then, i caculator the parameter from link : https://www.skottanselektronik.com/
My PCB manufacture is FAB-9 : https://fab-9.com/web/content/view/14/28/
All rule is true.
But, time the firt i design PCB multi layer.
I want to hear your advice
Thanks,