Politecnico
Member level 1
Hi guys
I have the laboratory experience of prototyping single 2-layer PCBs. Regarding the complexity of my new design and board size limitation, I am going to consider a 4-layer PCB.
Here is my question: since Through Hole and Blind and Buried vias are parts of multi-layer PCBs, is it possible to implement them manually -by hand- without any specific malfunctioning?
Any practical advice is highly appreciated, in advance.
I have the laboratory experience of prototyping single 2-layer PCBs. Regarding the complexity of my new design and board size limitation, I am going to consider a 4-layer PCB.
Here is my question: since Through Hole and Blind and Buried vias are parts of multi-layer PCBs, is it possible to implement them manually -by hand- without any specific malfunctioning?
Any practical advice is highly appreciated, in advance.