circuitking
Full Member level 5
Hello, I would like to open this thread one more time. I want to know the answer to what the user asked in the post.
Guidelines for designing a RF pad
By user :zhangjavier -"The PDK I am now using doesn't even provide me the model and layout of bondpad, so I have to design the bondpad layout myself and then extract the parasitics. The pad is to be used at about 3Ghz, so i want to know how to minimize the parasitical capacitance and resistance.And also i want it to be reliable."
Do I just connect all the metal layers with vias in the technology I am working with in Cadence virtuoso and run PEX simulation, which would give the model for bondpad?
Guidelines for designing a RF pad
By user :zhangjavier -"The PDK I am now using doesn't even provide me the model and layout of bondpad, so I have to design the bondpad layout myself and then extract the parasitics. The pad is to be used at about 3Ghz, so i want to know how to minimize the parasitical capacitance and resistance.And also i want it to be reliable."
Do I just connect all the metal layers with vias in the technology I am working with in Cadence virtuoso and run PEX simulation, which would give the model for bondpad?