Mercury
Member level 3
Hi guys,
I have 30V 50A MOSFET H-Bridge (at about 20kHz PWM), as well as a MCU with a 12-bit ADC on a 4 -layer PCB. The bridge is on the top layer and the MCU is on the bottom layer, but not directly under the bridge. The bridge will for sure generate disturbances which might influence the ADC. There are three routing scenarios that I'm considering:
- SPlit the ground layer into two regions, one for the bridge and one for the MCU. The regions would be connected at a single point
- Route the bridge in the top layer and the internal signal layer and run the ground layer underneath the bridge area
- Route the bridge in the top layer and the internal signal layer but the ground layer avoids the mosfet area
My PCB stack-up is Top, Middle, Ground, Bottom. So, what would you guys recommend me to do, in order to minimise the noise from the bridge?
George
I have 30V 50A MOSFET H-Bridge (at about 20kHz PWM), as well as a MCU with a 12-bit ADC on a 4 -layer PCB. The bridge is on the top layer and the MCU is on the bottom layer, but not directly under the bridge. The bridge will for sure generate disturbances which might influence the ADC. There are three routing scenarios that I'm considering:
- SPlit the ground layer into two regions, one for the bridge and one for the MCU. The regions would be connected at a single point
- Route the bridge in the top layer and the internal signal layer and run the ground layer underneath the bridge area
- Route the bridge in the top layer and the internal signal layer but the ground layer avoids the mosfet area
My PCB stack-up is Top, Middle, Ground, Bottom. So, what would you guys recommend me to do, in order to minimise the noise from the bridge?
George