chirag2004
Newbie level 4
best 4 layer board
Hello friends,
I have made single & double layer boards.But since we are working in RF & Wireless applications I want to make multilayer board for reduced EMI/EMC.
I have following doubts about 4 layer board:--
1) I got to know that for reduced EMI/EMC best option is first layer--GND
second layer-- VCC
third layer--SIGNAL
fourth layer--GND.
But then from top & bottom layer there will be only gnd fill area.Since I heard about BLIND & BURIED VIA, can I place any other tracks on top & bottom layer?
2) Is it like for 4 layer board using PROTEL:
First layer: TOP LAYER--GND
second layer:MID 1 LAYER--VCC
third layer: MID 14 LAYER--SIGNAL
fourth layer:BOTTOM LAYER-- GND
3) What is internal power planes as mentioned in PROTEL--OPTIONS--LAYERS?
4) PLZ help me by tips & suggestions to make 4 layer board.
Thanks in advance,
chirag.
Hello friends,
I have made single & double layer boards.But since we are working in RF & Wireless applications I want to make multilayer board for reduced EMI/EMC.
I have following doubts about 4 layer board:--
1) I got to know that for reduced EMI/EMC best option is first layer--GND
second layer-- VCC
third layer--SIGNAL
fourth layer--GND.
But then from top & bottom layer there will be only gnd fill area.Since I heard about BLIND & BURIED VIA, can I place any other tracks on top & bottom layer?
2) Is it like for 4 layer board using PROTEL:
First layer: TOP LAYER--GND
second layer:MID 1 LAYER--VCC
third layer: MID 14 LAYER--SIGNAL
fourth layer:BOTTOM LAYER-- GND
3) What is internal power planes as mentioned in PROTEL--OPTIONS--LAYERS?
4) PLZ help me by tips & suggestions to make 4 layer board.
Thanks in advance,
chirag.