darkk
Member level 3
Dear folks,
I am designing a mixed-signal circuit. The analog output is at 500 MHz and digital at around 200 MHz. In the bench test, I try to use chip-on-board. You can see the diagram in the attached picture. I will bond-wire the pads on the chip to the pads on the board, (i.e. no package for the chip). Since I just used probe station before, I'm not familiar with this kinda setup. So here I come up with a couple of questions:
1. Do I need to add the output buffer to drive the loads from the pads of on the chip and on the board?
2. If the buffer is needed, I guess that the 50 Ohms matching should be done at the output of the buffer. Am I right?
3. The same questions for digital part: output buffer and 50 Ohms matching?
Thanks for you guru's response!
-darkk
I am designing a mixed-signal circuit. The analog output is at 500 MHz and digital at around 200 MHz. In the bench test, I try to use chip-on-board. You can see the diagram in the attached picture. I will bond-wire the pads on the chip to the pads on the board, (i.e. no package for the chip). Since I just used probe station before, I'm not familiar with this kinda setup. So here I come up with a couple of questions:
1. Do I need to add the output buffer to drive the loads from the pads of on the chip and on the board?
2. If the buffer is needed, I guess that the 50 Ohms matching should be done at the output of the buffer. Am I right?
3. The same questions for digital part: output buffer and 50 Ohms matching?
Thanks for you guru's response!
-darkk