BGA package soldering on FR4 material

[info_req]

Is there any problem with soldering BGA package on FR-4 maetial. does Tg of laminate may disturb the laminate proprties.?

Actually we are designing PCB for BGA-676 pin package. The question is does FR-4 material serve the purpose or we should change material to FR-5 or polymide or some different material.

Thanks experts.

 

[marce]

The majority of boards are produced from FR4, I have done BGA designs for over 7 years and never used anything but FR4. Plenty of life left in FR4 yet. If you are using a lead free process I would look at a decent FR4, i.e. Tg of 170
it also works upto the low GHz's

 

[FvM]

Soldering profiles for BGA aren't different from other SMD components. The name "FR4" doesn't exactly specify the temperature behaviour, you should have laminate suited for leadless soldering, assuming you have it.

 

[marce]

Forgot as there is some IPC info for everything PCB based!

Look for IPC-7095B 'Design and assembly process implementation for BGAs'

 

[loosemoose]

The finish is more important that the material. I always use ENIG (immersion gold) for the flatness of the pads.

 

[info_req]

thanks for all of you. It really helped.

 

[jalnaghar]

hello
help me for subject the antennas in package for 2.4 GHZ

mi problem is design example for antenna 5*5 multilayer or in package at 2.4

GHz because using this antenna in SiP (System in package).

wat the technologies using for resolution the problem?

tank you

 

[info_req]

Your problem iss antenna design? but not as close to PCB design. Please give detail that where are you: at Antenna design stage or PCB design stage.