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3D integration using TSMC 65nm

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For designing a 3D IC, we need TSV (through silicon vias) to stack different substrate layers. But how do we get to know the size of the TSV's? In the document provided for TSMC 65nm, no information has been provided about the TSV's. What are the size of the TSV to build a 3D IC using TSMC 65nm technology node? Can monolithic ICs be designed using TSMC 65nm?
 

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