- 1st November 2006, 10:03 #1
- Join Date
- Nov 2006
- 0 / 0
quote for pcb thermal analysis
I'm try calculate a heat emission for rectifiers couple (suppy for audio power amp.), and use PCB as a heatsink (without additional metal sinks - don't ask me why), but can't find - how calculate sufficient ground foil pad. Incoming data:
From transformer- 45V AC, double Shottky diode in bridge (MBR2080 in 3 cases TO-220), average current- 3A (in peak - 5A). Most hardly power (and termal) conditions for "positive" part of bridge (case with common cathode is in constant load). Power dissipation on this body is (0,8V×3A) =2,4W - allowable. Thermal impedance body/ambient for TO-220 is around 50 C°/W. In fact I get rising temp up to 120 C° + ambient 25 C° = 145C. Too much...
If I place TO-220 (using screw) on bridge PCB, with appropriate area of foil pad - thermal impedance will lower, and temp will decrease.
OK, well, fine, (applauses), "smart guy", etc... But, on this moment I'm download long megabytes of tech.datas & datasheets concerning this question, even math modeling. Nowhere answer... In this galaxy possess any computation formula or not?
Tearfully ask: how (where) I did calculate demand area of two-layer PCB?!
- 1st November 2006, 10:03
pcb quotation formula
Try to visit this link, its offer a PCB thermal Analysis, I think it can help you a lot..
- 2nd November 2006, 06:25
- Join Date
- Oct 2004
- West Coast
- 2303 / 2303
pcb as heatsink
A:Is it possible to use the copper traces in the PCB (printed circuit board) as a heat sink? If so, how would I estimate the heat sink capability of the PCB, assuming that I know the pattern of copper traces and the thermal resistance of the component package?