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  1. #1
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    quote for pcb thermal analysis

    I'm try calculate a heat emission for rectifiers couple (suppy for audio power amp.), and use PCB as a heatsink (without additional metal sinks - don't ask me why), but can't find - how calculate sufficient ground foil pad. Incoming data:
    From transformer- 45V AC, double Shottky diode in bridge (MBR2080 in 3 cases TO-220), average current- 3A (in peak - 5A). Most hardly power (and termal) conditions for "positive" part of bridge (case with common cathode is in constant load). Power dissipation on this body is (0,8V×3A) =2,4W - allowable. Thermal impedance body/ambient for TO-220 is around 50 C°/W. In fact I get rising temp up to 120 C° + ambient 25 C° = 145C. Too much...
    If I place TO-220 (using screw) on bridge PCB, with appropriate area of foil pad - thermal impedance will lower, and temp will decrease.
    OK, well, fine, (applauses), "smart guy", etc... But, on this moment I'm download long megabytes of tech.datas & datasheets concerning this question, even math modeling. Nowhere answer... In this galaxy possess any computation formula or not?

    Tearfully ask: how (where) I did calculate demand area of two-layer PCB?!
    Thanks!

    •   Alt1st November 2006, 09:03

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  2. #2
    Full Member level 1
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    pcb quotation formula

    Try to visit this link, its offer a PCB thermal Analysis, I think it can help you a lot..

    Code:
    http://www.ansoft.com/news/articles/PCB_Thermal_Analysis_article.cfm?&vflash=y



    •   Alt2nd November 2006, 05:25

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  3. #3
    Advanced Member level 5
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    pcb as heatsink

    Q:
    Is it possible to use the copper traces in the PCB (printed circuit board) as a heat sink? If so, how would I estimate the heat sink capability of the PCB, assuming that I know the pattern of copper traces and the thermal resistance of the component package?
    A:
    http://www.coolingzone.com/Guest/New.../Jan_2001.html

    Regards,
    IanP



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