unevb
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If we are trying to connect 2 circuit blocks on the same chip through one of these 2 mediums :
i) metal interconnect
ii) integrated CPW / microstrip TL
Why is there less signal attenuation in the case (ii). Physically, the only difference between the 2 cases is that the ground track is explicit for the Transmission Line. In the CPW the ground consists of 2 metal lines adjacent to the conductor and in the microstrip we build the groud plane
How does that change the amount of signal attenuation?
i) metal interconnect
ii) integrated CPW / microstrip TL
Why is there less signal attenuation in the case (ii). Physically, the only difference between the 2 cases is that the ground track is explicit for the Transmission Line. In the CPW the ground consists of 2 metal lines adjacent to the conductor and in the microstrip we build the groud plane
How does that change the amount of signal attenuation?