What2learn
Newbie level 1
Hi,
In my PCB design,
Layer 1: Top Layer (RF Signals)
Layer 2: Mid 1 Layer (GND Plane)
Layer 3: Mid 2 Layer (Power tracks in star configuration)
Layer 4: Bottom Layer (Signals and GND plane)
Should I give multiple vias for Vcc pads in top layer to connect them to inner power routing, the same way where we use multiple vias for GND connection to create low impedance path?
Cheers,
In my PCB design,
Layer 1: Top Layer (RF Signals)
Layer 2: Mid 1 Layer (GND Plane)
Layer 3: Mid 2 Layer (Power tracks in star configuration)
Layer 4: Bottom Layer (Signals and GND plane)
Should I give multiple vias for Vcc pads in top layer to connect them to inner power routing, the same way where we use multiple vias for GND connection to create low impedance path?
Cheers,