Zangetsu57
Member level 4
Hello everyone,
I'm designing a high power beamformer (Rotman Lens), but am stumped as to what I should look for in a high frequency laminate to mitigate power loss through heat, and have high power handling capability. Clearly, I want the loss tangent to be low, but what about thermal conductivity?
Basically, I want to make sure that if I input the maximum alotted power through a SMA connector, the substrate doesn't get too hot and burn.
Thanks for any insight!
I'm designing a high power beamformer (Rotman Lens), but am stumped as to what I should look for in a high frequency laminate to mitigate power loss through heat, and have high power handling capability. Clearly, I want the loss tangent to be low, but what about thermal conductivity?
Basically, I want to make sure that if I input the maximum alotted power through a SMA connector, the substrate doesn't get too hot and burn.
Thanks for any insight!