Thanks, the 4x4 pad is more than 50% biger then the 3x3 pad so we will be able to get more thermal vias in it, and much better cooling.....i wonder why Seoul Semiconductor did not say a 4x4 thermal pad was allowable?
I mean surely making it 4x4 is a win/win situation?
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Our PCB layout engineer has placed five thermal vias of diameter 0.65mm in the thermal pad of our DT3001 IC. (as in the jpeg attached).
he seems to have just used five square PTH vias, which as you can see , dont fit together very well and hence there is solder resist between them. Is this bad?
So he has got solder resist over the thermal pad. (as attached)
Surely 0.65mm is way too big for a thermal via in such a small thermal pad?
(he has made the thermal pad 3mm x 3mm)