Why can't we make connections on a wafer from the sides, why is it only from the top?

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Why cant we make connections on a wafer from the sides, why is it only from the top ?

Why cant we make connections on a wafer from the sides, why is it only from the top ?
 

Re: Why cant we make connections on a wafer from the sides, why is it only from the t

A typical circuit has a seal ring around. That seal ring uses all metal layers. So there is no way to effectively reach the edge. Plus, edges are really rough after dicing. That signal wouldn't be able to go anywhere reliably.

If you are talking about uncut die, then yes, it is possible to connect multiple dies on the same wafer. It's not typical though, would require a foundry to play along. Which they will not do.
 

Re: Why cant we make connections on a wafer from the sides, why is it only from the t

Through-silicon via (TSV) processing either BEOL or
post-fab can get you access through the backside.
 

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