ap001
Newbie level 3

soc and sop
Hi Dear Friends;
I am looking for a new job as an RF engineer. I got two opportunities: one is to be an RF transceiver IC desiging engineer and the other is to be an RF LTCC (low temperature co-fired ceramic) module designing engineer. SOC seems the main trend for the whole IC industry, but it is said that RF front-end is difficult, if possible, to be assembled with other blocks of chips and the solution to this problem is system on package (SOP). LTCC is one form of SOP. Would you guys give me some advises?
best regards,
ap001
Hi Dear Friends;
I am looking for a new job as an RF engineer. I got two opportunities: one is to be an RF transceiver IC desiging engineer and the other is to be an RF LTCC (low temperature co-fired ceramic) module designing engineer. SOC seems the main trend for the whole IC industry, but it is said that RF front-end is difficult, if possible, to be assembled with other blocks of chips and the solution to this problem is system on package (SOP). LTCC is one form of SOP. Would you guys give me some advises?
best regards,
ap001