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What kind of chip does this travel alarm clock use ?

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victor6799

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I took apart a $5 travel alarm clock as shown in the picture below. I wanted to know what sort of chip(s) are being deployed by this clock to display the time. Does it use a microprocessor or a CPU core ? How many die, layers would be found embedded in the central chip that is used in this travel clock.

$_35.JPG
IMG_0320.JPG
 
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This is probably a die-bonded chip. There are alarm clock chips available off-the-shelf, or this might be a custom chip. Why do you ask?
 

This is probably a die-bonded chip. There are alarm clock chips available off-the-shelf, or this might be a custom chip. Why do you ask?
Would it deploy a single CPU core ? Do die-bonded chips come equipped with a CPU core ? I'm new to the field of electronics and just wanted to know from a educational perspective.
 

Hi,

a CPU needs some code (software) to run.
But for a high volume produced simple alarm clock you may do without software, just hardware.

But surely it´s possible to us a microcontroller and software.

Klaus
 

Almost all chips can be die bonded. Of course there are
special treatments and packages for chips considered for
high freq work or high power or special environmental.

Increasingly over the last few years standard micro cores
are being used for stuff like this, no special development
costs associated with customs, leading edge processes used
for processors, multi source for some, like ARM, low die size
and low die cost. Ability to program, for many, during
manufacturing/final test.


Regards, Dana.
 

Hi,

a CPU needs some code (software) to run.
But for a high volume produced simple alarm clock you may do without software, just hardware.

But surely it´s possible to us a microcontroller and software.

Klaus
If its possible to use a microcontroller and software would this chip not require some SDRAM ?
 

If its possible to use a microcontroller and software would this chip not require some SDRAM ?
No. This is a clock, not a computer.

Microcontrollers have onboard RAM, FLASH, ROM, etc. No need for anything external, and certainly no need for SDRAM.
 

Almost all chips can be die bonded. Of course there are
special treatments and packages for chips considered for
high freq work or high power or special environmental.

Increasingly over the last few years standard micro cores
are being used for stuff like this, no special development
costs associated with customs, leading edge processes used
for processors, multi source for some, like ARM, low die size
and low die cost. Ability to program, for many, during
manufacturing/final test.


Regards, Dana.
--- Updated ---

Where can I get more information on the type/model of the chip that is actually being used here ? Will the manufacturer give out this information ?
 

--- Updated ---

Where can I get more information on the type/model of the chip that is actually being used here ? Will the manufacturer give out this information ?
A good source is actually consulting companies that do the designs for the manufacturer.

You would have to develop a relationship with them. Trade shows a good source of
info across industries/applications. Even manufacturing trade shows can produce
leads by simple discussion with various vendors at the shows.

Another is field engineers for manufacturers as they typically are a resource
used by the product designers.

Semi manufacturers marketing departments can be a source of where/how stuff is
being done in various markets.

You can delid parts in and look at die under a simple microscope,
typically trademarks on die.


Regards, Dana.
 
Hi,
Will the manufacturer give out this information ?
Best way to find out is to simply ask them.

Did you ever tell why you want to know all this?

Let's imagine you find out this is a PIC with the according software?
What will be your next steps then?

Klaus
 

Thanks for the helpful post.
--- Updated ---

Hi,

Best way to find out is to simply ask them.

Did you ever tell why you want to know all this?

Let's imagine you find out this is a PIC with the according software?
What will be your next steps then?

Klaus
My next step would be to view the surface of the die (IC) once it has been decapped. Then to determine how many layers does it have.
 
Last edited:

I took apart a $5 travel alarm clock as shown in the picture below. I wanted to know what sort of chip(s) are being deployed by this clock to display the time. Does it use a microprocessor or a CPU core ? How many die, layers would be found embedded in the central chip that is used in this travel clock.

$_35.JPG
IMG_0320.JPG


The cheapest 2 bit ($0.25)
uC ASIC possible = proprietary.

they use toxic solvents. Don't try at home. But you can X-ray it.

a friend of mine invented the 1st PIC LED watch
 

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