Almost all chips can be die bonded. Of course there are
special treatments and packages for chips considered for
high freq work or high power or special environmental.
Increasingly over the last few years standard micro cores
are being used for stuff like this, no special development
costs associated with customs, leading edge processes used
for processors, multi source for some, like ARM, low die size
and low die cost. Ability to program, for many, during
manufacturing/final test.
Regards, Dana.