It's just like metal fill. Modern technologies have tight requirements to avoid underfill/overfill in vias. Innovus, however, is not smart enough to handle this. TSMC offers external scripts to do fill, for instance.
Why extra VIAs are placed during metal fill in INNOVUS?
When I use "Route->Metal fill-> add " option in INNOVUS , along with the metal dummy layers, it also place many vias across the core. I have found no option to prevent this. Why this via's are placed along with metal fill ? what kind of purpose this serve ?
There is an option for via fill in "Route -> via fill -> add" so that one can include via fill if needed. I have found no need to add some vias along with metal fill by default .
Any link of resources for better understanding will be appreciated. I'm using TSMC180 technology.
Thank you for your time.