What is Ground loop / Bounce and how to reduce it?

[jb8822]

What is Ground loop / Bounce and how to reduce it?

 

[marce]

Re: Ground loop / Bounce

Refer to my answer on your other thread.

 

[PCB design]

■ Add the recommended decoupling capacitors for as many
VCC/GND pairs as possible.
■ Place the decoupling capacitors as close as possible to the power and
ground pins of the device.
■ Add external buffers at the output of a counter to minimize the
loading on Altera device pins.
■ Configure the unused I/O pin as an output pin and then drive the
output low. This configuration acts as a virtual ground. Connect this
low driving output pin to GNDINT and/or the board’s ground plane.
■ For MAX 7000AE devices, any unused I/O pin may be driven to
ground by programming the “programmable ground” bit (one per
I/O cell). In doing so, the macrocell will not need to be sacrificed, but
can still be used as a buried macrocell.
■ When speed is not critical, turn on the slow slew rate logic option for
APEXTM II, APEXTM 20K, MercuryTM, ExcaliburTM, FLEX® 10K,
FLEX 8000, FLEX 6000, MAX 9000, MAX 7000A, and MAX 7000
designs.
■ Limit load capacitance by buffering loads with an external device,
such as the 74244 IC bus driver, or by reducing the number of devices
that drive the bus.
■ Eliminate sockets whenever possible.
■ Reduce the number of outputs that can switch simultaneously
and/or distribute them evenly throughout the device.
■ Move switching outputs close to a package ground pin.
■ Create a programmable ground next to switching pins.
■ Eliminate pull-up resistors or use pull-down resistors.
■ Use multi-layer PCBs that provide separate VCC and ground planes.
■ Add 10- to 30-Ω resistors in series to each of the switching outputs to
limit the current flow into each of the outputs.
■ Create synchronous designs that will not be affected by momentarily
switching pins.
■ Assign I/O pins to minimize local bunching of output pins.

■ Place the power and ground pins next to each other. The total
inductance will be reduced by mutual inductance, since current flows
in opposite directions in power and ground pins.
■ Use a bigger via size to connect the capacitor pad to the power and
ground plane to minimize the inductance in decoupling capacitors.
■ Use the wide and short trace between the via and the capacitor pad
or place the via adjacent to the capacitor pad.

■ Use surface mount capacitors to minimize the lead inductance.
■ Use low effective series resistance (ESR) capacitors. The ESR should
be < 400 mΩ.
■ Each GND pin/via should be connected to the ground plane
individually.
■ To add extra capacitance on the board, Altera recommends placing a
ground plane next to each power (VCC) plane. This placement gives
zero lead inductance and no ESR. The dielectric thickness between
the two planes should be ~5 mils.