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Flip chip IO is for flip chip package.
Inline and staggered IO is only different in IO pitch.
For example, Inline IO pitch is 100um and staggered IO is only 50um.
Choosing inline or staggered IO is decided by the real chip whether it is core limit or IO limit.
in the simpler sense, flip chip io places IO pad on chip internal. Inline aligns all IO pads at each sides of the core. Staggered IO use two rows to aligns IO pads.
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