What are the issues in single chip integration when the chip has analog, rf, and digital as well as baseband blocks... should everything be differential ? do you need good process for isoltation ? careful layout ?
what other isses are there ? floorplanning ?
any papers, thesis or books or opinions would be helpful !
I think don't forget ohmic law, IR drop, ground bounce due to inductance.
On chip isolation, take care the guard ring, even the seal ring alos makes
issues. Identify the blocks which are sensitive, noisy..etc.