Hi Friends, In 90, we should face the wire delay, SI and IR issues, who can tell me,
from 90nm to 65nm, what are the new chanllenges we should face?
Thanks
Re: What are the challenges we should face when we move to 6
In 65nm , we face probs with these interconnects mainly..and all those which u have mentioned ...
Intel has come out a solution for this probs..It is using Lasers in place of interconnects for its next generation processors ......
Refer the Intel Site for more details...
Added after 5 minutes:
In 65nm , we face probs with these interconnects mainly..and all those which u have mentioned ...
Intel has come out a solution for this probs..It is using Lasers in place of interconnects for its next generation processors ......
Refer the Intel Site for more details...
I am doing the atpg pattern generation and simulations at 65nm.i have to go to the tester lever and i have to debug there.is there any material which wil discribe the problem faced in all these stages.please help me i am new to this technology.
As the technology shrinks the interconnect delays dominate over the gate delay. This is main challenge in lower technology node.
Short channel effect comes into picture. Device will reach into the saturation even before pinch off.
The VIA's resistance get increased as the technology shrinks