rahul91
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Hi,
I am designing a welding machine PCB(2 layer). Its rated output current is 20V,250A...To handle this current we planned to solder thick copper conductors on the bottom side of PCB( areas of high current density). But if we go for via stitching in the high current dense areas(100 mil gap between adjascent vias and vias exposed) so that to increase the area, can we handle 250A current , without soldering thick copper conductors on the bottom side...??? If not can we achieve the required area by changing circular vias to rectangular slots...??? A portion of the PCB file is attached as an image...The region with 250A current is highlighted using a yellow rectangular box. The region is 400 mil wide and 2 ounce thick copper is used...
Also a via will act as an LPF...If we go with large number of vias , will that cause any problems, since our switching frequency can be upto 100KHz...???
Thanks in advance...
I am designing a welding machine PCB(2 layer). Its rated output current is 20V,250A...To handle this current we planned to solder thick copper conductors on the bottom side of PCB( areas of high current density). But if we go for via stitching in the high current dense areas(100 mil gap between adjascent vias and vias exposed) so that to increase the area, can we handle 250A current , without soldering thick copper conductors on the bottom side...??? If not can we achieve the required area by changing circular vias to rectangular slots...??? A portion of the PCB file is attached as an image...The region with 250A current is highlighted using a yellow rectangular box. The region is 400 mil wide and 2 ounce thick copper is used...
Also a via will act as an LPF...If we go with large number of vias , will that cause any problems, since our switching frequency can be upto 100KHz...???
Thanks in advance...