Generally speaking , which MOSFET package is better for dissipating heat:-
TO220 or DPAK.
Please consider that all their electrical parameters are the same.
Please also consider that they are both mounted without heatsinks, and with the minimum PCB copper land pattern......(i.e. no extra PCB copper available for heatsinking in either case)
If you check www.st.com/stonline/books/pdf/docs/10855.pdf for example which is produced in both TO220 and DPAK,
you can see that TO220 has better heat characteristics (thermal resistance) and also has higher total dissipation for the same temperature