Hi,
A certain big European Electronics distributor, who i believe , possibly has associations with Nexperia and Vishay, are currently doing the rounds, and saying that soon, all through hole Power MOSFETs for eg SMPS will be obsolete....and that SMD FETs will prevail.
Unless you have a 200MHz scope and high quality scope probes - you may not see the true rise and fall times - have you calibrated your probes? - via the 5V square wave on the scope Fet temp rise is very heatsink dependent - and air flow dependent - 60-65 C on the fets is usually...
www.edaboard.com
..we have one of the world's best SMPS engineers saying that...
Timescale and coordination between vendors are missing from
this FUD-fart. People are putting new SiC devices out in through
hole leaded packaging so I find the statement not-credible.
You'd have some fun trying to get power-tab heat levels out
through PCB planes sideways. Not sure there are good SMD
heat sinks for small packages (it's all about the small, until it
isn't).
As long as MOSFETs will have to dissipate significant power (more than a few watts) in an application, through-hole devices mounted on a large heat-sink will still be needed.
Thanks, though as you know, with a high power sync buck at high frequency of 500kHz....you just cant get away with TO220 FETs on heatsinks...it Must be done via SMD FETs...so as to get the good layout......but then that board has to be mounted to a heatsink....and thats where all the screws and stuff that you dont want come into it.