The substrate manufacturer
does give you a choice between different metalization types.
For substrates like FR4, you can choose from different metal thickness, because the low frequency/power guys sometimes want thick metal for lower ohmic loss at DC. For 900MHz, see skin effect discussion above.
For "RF" substrates like Rogers, you can choose different thickness and also between different roughness values (smooth rolled copper is the electrical engineer's choice for lower loss, rough electrodeposited surface has better adhesion to the substrate over temperature cycles).
https://www.rogerscorp.com/documents/749/acm/Copper-Foils-for-High-Frequency-Circuit-Materials.aspx