Hi!!!
The power ring is routed around digital chip, black box.
Stripes - vertical and horizontal continuation of power ring for improvement of
current flow.
Power pad could be also an exposed pad, usually used for heatsink removal.
It's connected to ground and must be well designed with a lot of vias connecting GND planes on every layer involved in design.
Hi, i' ve been working with power planning in the past months. There is a good tutorial for power planning that explains what you need at **broken link removed** (it is for Cadence Encounter but has screenshot's of rings, stripes, etc..) I hope it will help.