May 9, 2014 #1 J Jester Full Member level 6 Joined Aug 18, 2012 Messages 377 Helped 7 Reputation 14 Reaction score 7 Trophy points 1,298 Location . Activity points 4,754 When using a bare pad (either SM or through hole) specifically for a test point, should I remove the solder paste for the specified pads? The board will be finished ENIG and tested on an automated test fixture that uses pogo pins to mate with these test points. I would think that probing test points with solder will (over time) contaminate the tip of the pogo pin. Thoughts?
When using a bare pad (either SM or through hole) specifically for a test point, should I remove the solder paste for the specified pads? The board will be finished ENIG and tested on an automated test fixture that uses pogo pins to mate with these test points. I would think that probing test points with solder will (over time) contaminate the tip of the pogo pin. Thoughts?
May 9, 2014 #2 B bhushan233k Junior Member level 2 Joined Jul 29, 2012 Messages 21 Helped 1 Reputation 2 Reaction score 1 Trophy points 1,283 Location PUNE Activity points 1,400 For tp no use of solder paste...