Jester
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When using a bare pad (either SM or through hole) specifically for a test point, should I remove the solder paste for the specified pads?
The board will be finished ENIG and tested on an automated test fixture that uses pogo pins to mate with these test points.
I would think that probing test points with solder will (over time) contaminate the tip of the pogo pin.
Thoughts?
The board will be finished ENIG and tested on an automated test fixture that uses pogo pins to mate with these test points.
I would think that probing test points with solder will (over time) contaminate the tip of the pogo pin.
Thoughts?
