System level thermal analysis in AEDT icepack using stepfile

S

sarathkayila

Newbie
Joined
May 10, 2024
Messages
3
Helped
0
Reputation
0
Reaction score
0
Trophy points
1
Activity points
26
Hey guys,
New to Electronics desktop here. I've the step file of a PCB board with components and want to perform a thermal analysis in Electronic desktop icepack. When I try to import the step file the components are assigned random names and property which I can't identify. Do I have to manually assign material and power dissipation to each one. Is this the procedure for thermal analysis. How will I give the board properties? Is there any specific procedure to make this easy ? Ps.: I don't have access to space claim or any cad software. PlS help
 

Sort by date Sort by votes
sarathkayila said:
Do I have to manually assign material and power dissipation to each one.
Click to expand...
Yes. This will be done in icepack. Depending on analysis objectives, you possibly need to add details to the board model, e.g. copper planes or thermal vias.
sarathkayila said:
I don't have access to space claim or any cad software.
Click to expand...
There are free tools like FreeCAD.
 

Upvote 1 Downvote
FvM said:
Yes. This will be done in icepack. Depending on analysis objectives, you possibly need to add details to the board model, e.g. copper planes or thermal vias.
Click to expand...

Thank you for the reply. I will proceed like this.
Is there any common material to be assigned for electronics packages in the library or will it be different for each group?
 

Upvote 0 Downvote
You must log in or register to reply here.

Similar threads

Menu
Log in
Register
Cookies are required to use this site. You must accept them to continue using the site. Learn more…