[SOLVED] Solder mask defined pads

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arunmaran10

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Hi All,
I am using 81 pin WLCSP package IC. In socket recommended pad dia is 0.3mm. But for 0.4mm pitch suggested pads is 0.265mm pad.

This is not matter for socket still i have to connect 2,3 pads diagonally in top layer. To do this i have to reduce some pad size. I need to know whether different pad size will affect assembly. Because i have doubt that there may be chance of short with adjacent pads during wave or re flow soldering if we have different pad size.

This is the case if i want to solder device in socket board.

Regards,
Arunmaran
 

Can you please tell what's the Pitch of your WLCSP package and send some snapshot of your socket.

Reg assembly Issue: Pls check with your assembly house depends upon her capability only we will decide.
 

Yes different pad sizes will affect assembly.
This device will have to be reflowed, you are not going to wave solder a device of this pitch.....
Why do you have to reduce the pad size to join the pads?
 

Hi Marce,
Because 0f 3.5mill trace width/spacing i have to reduce pad size.
 

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