Even the DC line given above is a thing to be taken carefully, as from the graph the limit is 2v5 @ 100+A = 250+ watts,
this is only possible by keeping the junc to 25 deg C, i.e. the heat flow thru the die is enormous and these tests are rarely performed in the real world as the cooling mechanisms required are quite involved - instead they are calculated from die size and method of soldering the chip down.
In the real world any sort of cyclic operation to the 250W point and back to lower powers would cause die failure due to mismatch of TCE in the layering of components ... - unless the junc could be firmly held to 25deg C under all conditions ( unlikely ).