It's not clear how your "combined ground lines setup" exactly looks like. Common ground bond wires? Different ground metal layout than the separated setup?
Even more interesting, which "noise" sources do you consider? According to wave forms, you have either similar noise sources in the analog section, or other on-chip coupling pathes between digital and analog section.
Does your setup involve IO currents? Strongest effect of ground wiring is caused by ground bounce, of course only occuring with clock sources and loads connected.