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Regarding Technology file and Interconnect Technology file

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Anjali0

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Hi,

Can I get a clarity on the files, Technology file (tech.lef) and Interconnect Technology file (ict or ptf or itf).

When I open them I saw the Metal Layer details in both files.

Interconnect Technology file is having mostly Resistance and Capacitance values of Metal Layers.

Technology file is is also having a similar Metal Layers details.

But my doubt is what is the actual difference and the actual need of both files for the ASIC Physical Design.

Why we need both files for ASIC Physical Design?

Why a not single file for Metal Layer details?


A good explanation will be appreciated.
 

The technology file (.lef) contains also the antenna and DRC rules.
ITF only describe the layer, and it used to generate the nxtgrd, captbl files.
 

The technology file contains antenna and DRC rules for the layers which is used by the Router to route and contact the cells during P&R phase.

The ICT/ITF file contains material details of each layer (resistivity, dielectric constants, temperature coefficients, etch values for conductors, min-space, min-width, etch vs. width vs. spacing) etc. details, which are used to generate nxtgrd/captable/qrcTechfile database. This database is used during extraction to extract device parasitic RC and wire RC from the final layout after P&R since RC affects timing.
 

I have the ITF file, I use the grdgenxo command to build the .nxtgrd,
but it includes lots of binary stuf that I would like to read for my manual estimations.
Is there a way to build .nxtgrd file WITHOUT binary ?

Thks, Rgds,
OkGuy
 

In place of nxtgrd .. build tluplus. tluplus is little off in comparison to nxtgrd .. but you can read it and do manual estimation.
 

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